Method of predicting shape of semiconductor device
US11341305B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2019 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Nov 23, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of predicting a shape of a semiconductor device includes implementing a modeled semiconductor shape with respect to a designed semiconductor layout, extracting a plurality of samples by independently linearly combining process variables with respect to the modeled semiconductor shape; generating virtual spectrums with respect to ones of the extracted plurality of samples through optical analysis, indexing the virtual spectrums to produce indexed virtual spectrums, generating a shape prediction model by using the indexed virtual spectrums as an input and the modeled semiconductor shape as an output, and indexing a spectrum measured from a manufactured semiconductor device and inputting the spectrum to the shape prediction model to predict a shape of the manufactured semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.