Power module
US11342241B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2019 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Aug 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module, including: a first conductor, disposed at a first reference plane; a second conductor, disposed at a second reference plane, wherein projections of the first and second conductors on the first reference plane have a first overlap area; a third conductor, disposed at a third reference plane; a plurality of first switches, first ends of which are coupled to the first conductor; and a plurality of second switches, first ends of which are coupled to second ends of the first switches through the third conductor, and second ends of the second switches are coupled to the second conductor, wherein projections of minimum envelope areas of the first and second switches on the first reference plane have a second overlap area, and the first and second overlap areas have an overlap region. Heat sources of the power module are evenly distributed and its parasitic inductance is low.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.