Carrier board and power module using same
US11342257B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2021 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Jan 21, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier board and a power module using the same are disclosed. The carrier board includes a main body, two metal-wiring layers and at least one metal block. The main body includes at least two terminals and a surface. The two terminals are disposed on the surface. The two metal-wiring layers are disposed on the main body to form two parts of metal traces connected to the two terminals, respectively. The at least one metal block is embedded in the main body and connected to one of the two terminals. A thickness of the two parts of metal traces is less than that of the metal block. The two terminals connected by the two parts of metal traces have a loop inductance less than or equal to 1.4 nH calculated at a frequency greater than 1 MHz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.