Array substrate and manufacturing method thereof
US11342397B2 · kind B2 · utility
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Key dates
| Filing date | Nov 12, 2019 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Aug 7, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
Abstract
An array substrate and a manufacturing method thereof are provided. The array substrate includes a flexible substrate, a plurality of thin film transistors, a plurality of replacement units, an organic filling layer, a source and drain layer, a planarization layer, an anode layer, and a pixel definition layer. The organic filling layer is made of a flexible material which has good bendability. Thus, a risk of breakage or crack during a bending process is reduced, thereby realizing a dynamic folding of the array substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.