Sapphire collector for reducing mechanical damage during die level laser lift-off
US11342478B2 · kind B2 · utility
1Cited by
64References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2016 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Jul 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7806
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.