Method of making printed circuit board and laminated structure
US11343918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2018 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Dec 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.