Patent · US Active

Method for producing an electronic control module

US11343920B2 · kind B2 · utility

0Cited by

0References

14Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Udo Kaess · Walheim, DE
Uwe Katzenwadel · Oberriexingen, DE
Peter Weiberle · Sachsenheim, DE

Key dates

Filing date	Mar 21, 2018
Grant date	May 24, 2022
Priority date	—
Expiry date	Aug 16, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10378
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for producing an electronic sensor module includes applying first soldering material onto electrical soldering pads of a printed circuit board element and/or electrical soldering pads of a printed circuit board element contact side of a sensor carrier, arranging the sensor carrier with the electrical soldering pads of the printed circuit board element contact side on the electrical soldering pads of the printed circuit board element to produce electrical connections between connecting lines and the printed circuit board element, applying second soldering material onto electrical connecting elements of a sensor element and/or soldering pads of the sensor receptacle, arranging the sensor element in the sensor receptacle such that the second soldering material produces electrical connections between the electrical connecting elements of the sensor element and the soldering pads of the sensor receptacle, and reflow-soldering the first soldering material and the second soldering material in a joint reflow-soldering process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.