Power conversion device including cooling components
US11343942B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2018 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | May 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10431
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.