Overlapping bonded structure
US11344969B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 31, 2018 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Aug 1, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/006
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides an overlapping bonded structure in which breaking of a bonded section at holes formed during bonding can be prevented when an overlapping section formed by overlapping a plurality of meal plate members is bonded by means of a mechanical bonding means or a friction stir spot-welding means. This overlapping bonded structure, in which overlapping portions of a plurality of plate members are spot-welded at a plurality of bonded sections by means of a mechanical bonding means or a friction stir spot-welding means, and in the bonded sections a hole into which the mechanical bonding means is inserted or a hole formed during the spot-welding by the friction stir spot-welding means exists in at least one plate member, is characterized in that a cutout recess is formed between adjacent bonded sections, from an end portion of the overlapping section in the bonded-section direction, in the overlapping section of at least one of the plate sections, and when the inner diameter of the hole is K, an inside bottom portion of the cutout recess is formed at a position having a depth of K or greater from the end portion of the overlapping section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.