Heat-shrinkable multilayer film
US11345124B2 · kind B2 · utility
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3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2018 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | May 5, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31746
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat-shrinkable multilayer film according to the present invention is obtained by laminating an inner surface layer that contacts contents, an adhesive layer, and an intermediate layer that is adjacent to the adhesive layer, in this order from an inner side to an outer side. The inner surface layer contains an ethylene-vinyl acetate copolymer, the adhesive layer contains an acid-modified ethylene-based copolymer, and the intermediate layer contains a polyamide-based resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.