High temperature tie layer compositions, and articles made therefrom
US11345800B2 · kind B2 · utility
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11Claims
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Assignee
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Key dates
| Filing date | Apr 18, 2019 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Apr 18, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/062
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tie layer composition comprising from 60 wt. to 95 wt. % of a first polyethylene composition comprising a first molecular weight ethylene-based polymer component and a second molecular weight ethylene-based polymer component, wherein the polyethylene resin has a density from 0.940 to 0.960 g/cc and a melt index (I2) from 0.01 to 5 g/10 min; and from 5 wt. % to 40 wt. % of a second polyethylene composition comprising: (i) a high density polyethylene having a density greater than or equal to 0.940 g/cc; and (ii) a maleic-anhydride grafted polyethylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.