Deposition mask and method of manufacturing the deposition mask
US11345988B2 · kind B2 · utility
2Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2019 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Nov 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/166
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing a deposition mask includes preparing a mask-target substrate which has one surface on which a sacrificed layer pattern is formed and comprises a cover area covered by the sacrificed layer pattern and a plurality of exposed areas exposed by the sacrificed layer pattern; forming holes in the exposed areas of the mask-target substrate by emitting laser toward the mask-target substrate; and removing the sacrificed layer pattern, wherein the sacrificed layer pattern has a higher reflectance with respect to the laser than a reflectance of the mask-target substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.