Method for enhancing the adhesion of a layer for the protection of silver against tarnishing on a substrate comprising a silver surface
US11345993B2 · kind B2 · utility
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28Claims
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Key dates
| Filing date | Sep 16, 2019 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Dec 14, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/64
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is described for protecting a silver surface against tarnishing. This involves depositing a layer of a silver-copper alloy on a substrate, which may be a silver substrate. The alloy comprises between 0.1 wt % and 10 wt % of copper relative to the total weight of the alloy. At least one layer of a metal oxide or a nitride having a thickness in a range of 1 nm to 200 nm is deposited on the alloy to protect against tarnishing. The presence of copper in the silver-copper alloy enhances the alloy's adhesion without altering the silver color.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.