Sensor element, sensor arrangement, and method for manufacturing a sensor element and a sensor arrangement
US11346726B2 · kind B2 · utility
0Cited by
19References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2015 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Feb 28, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor element, a sensor arrangement, and a method for manufacturing a sensor element and a sensor arrangement are disclosed. In an embodiment, a sensor element includes a ceramic main body having at least one electrode arranged at the main body and having at least one contact piece for the electrical contacting of the electrode, wherein the contact piece is fastened to the electrode by welding or bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.