Electronic device module, method of manufacturing the same and electronic apparatus
US11347273B2 · kind B2 · utility
1Cited by
12References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2020 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Sep 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.