Transparent conductive structure and preparation method thereof, display substrate and touch substrate
US11347337B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 10, 2020 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Feb 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a transparent conductive structure and a preparation method thereof, a display substrate, and a touch substrate, which belongs to the technical field of display panels. The transparent conductive structure is provided on a substrate. The method for manufacturing a transparent conductive structure includes: providing the substrate; forming a transparent conductive layer on the substrate; forming a heat insulation layer on a surface of the transparent conductive layer away from the substrate, the heat insulation layer having at least one window region exposing the transparent conductive layer; heating the transparent conductive layer for a preset time period, to form at least one insulating region on the transparent conductive layer; and removing the heat insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.