Method of fabricating a light emitting device having a polymer film with a specified surface rouggness
US11349099B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Jan 24, 2020 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Jan 24, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of fabricating a light emitting device comprises providing a mold having an unpolished surface with an arithmetic mean roughness Ra in a range from 0.1 μm to 10 μm, depositing a thin polymer film over the surface of the mold, wherein the film has a thickness in a range from 1 μm to 100 μm, positioning a light emitting body onto the thin polymer film, wherein the light emitting body includes an anode, a cathode, and a light emitting layer positioned between the anode and the cathode, and separating the thin polymer film with the light emitting body from the mold. A light emitting device is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.