Automotive radar sensor packaging methods and related assemblies
US11349203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2020 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Sep 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
RADAR or other sensor assemblies/modules, particularly those for vehicles, along with related manufacturing/assembly methods. In some embodiments, the assembly may comprise a housing and a printed circuit board. The printed circuit board may comprise a first side and a second side opposite the first side and may further comprise one or more integrated circuits positioned on the first side of the printed circuit board. One or more antennas may be operably coupled with the integrated circuit. A flexible radome, such as a thermoplastic wrapper, may enclose the assembly and may provide the means for binding the printed circuit board to the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.