Micro-strand transceiver heat dissipation system
US11349509B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2020 |
| Grant date | May 31, 2022 |
| Priority date | — |
| Expiry date | Nov 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro-strand transceiver device heat dissipation system includes a transceiver device chassis, at least one transceiver component located in the transceiver device chassis, and micro-strand heat dissipator elements that are each positioned in the transceiver device chassis in a spaced apart orientation from the others of the micro-strand heat dissipator elements. Each of the micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that engages the at least one transceiver component, and a second micro-strand heat dissipator element portion that extends from the at least one transceiver component. The first micro-strand heat dissipator element portion on each of the micro-strand heat dissipator elements conducts heat generated by the at least one transceiver component to the second micro-strand heat dissipator element portion on that micro-strand heat dissipator element, which allows that heat to be dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.