Patent · US Active

Micromechanical sound transducer

US11350217B2 · kind B2 · utility

5Cited by

4References

56Claims

0Family size

Assignee

Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

Fabian STOPPEL · Itzehoe, DE
Bernhard Wagner · Fellbach, DE
Shanshan GU-STOPPEL · Itzehoe, DE

Key dates

Filing date	Nov 22, 2019
Grant date	May 31, 2022
Priority date	—
Expiry date	Jul 10, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2499/11
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A micromechanical sound transducer according to a first aspect includes a first bending transducer with a free end and a second bending transducer with a free end, the two bending transducers being arranged in a mutual plane, wherein the free end of the first bending transducer is separated from the free end of the second bending transducer via a slit. The second bending transducer is excited in-phase with the vertical vibration of the first bending transducer. A micromechanical sound transducer according to a second aspect includes a first bending transducer that is excited to vibrate vertically and a diaphragm element extending vertically to the first bending transducer, the diaphragm element being separated from a free end of the first bending transducer via a slit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.