Powder packing methods and apparatus
US11351605B2 · kind B2 · utility
0Cited by
15References
20Claims
0Family size
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Key dates
| Filing date | May 18, 2017 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Jul 3, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present disclosure generally relates to powder packing for additive manufacturing (AM) methods and systems. Conventional powder packing methods are manual and non-standardized, and they result in operator fatigue and potentially product inconsistencies. Powder packing according to the present disclosure improves standardization and reduces turnaround time, with the potential to lower the cost of AM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.