Patent · US Active

Semi-open high-temperature heat pump system and working method thereof

US11353242B2 · kind B2 · utility

1Cited by
0References
10Claims
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Assignee

Inventors

Key dates

Filing dateDec 24, 2020
Grant dateJun 7, 2022
Priority date
Expiry dateDec 24, 2040

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P80/15
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A semi-open high-temperature heat pump system including a compressor, a direct-contact condenser, a heat exchanger, an evaporator, a water purifier, a cold water pump, a hot water pump, a circulating water pump, and a vacuum pump. A discharge port of the compressor is connected to the direct-contact condenser, the direct-contact condenser is connected to the evaporator via the heat exchanger, and the evaporator is connected to a gas suction port of the compressor via a gas vent on its top. An outlet of the water purifier is separately connected to the compressor, the direct-contact condenser, and the evaporator via the cold water pump. An outlet at the bottom of the evaporator is connected to the direct-contact condenser via the circulating water pump. The vacuum pump is connected above the direct-contact condenser, and the hot water pump is connected below the direct-contact condenser.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.