Thermal profiles
US11353940B2 · kind B2 · utility
0Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2018 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Oct 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20209
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An example apparatus comprising a heat dissipation mechanism and a controller to detect a temperature of a surface of the apparatus, in response to detecting that an audio output device is connected to the apparatus, determine a thermal profile, and instruct the heat dissipation mechanism to dissipate heat from the apparatus based on the thermal profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.