Laser-scribed grain-oriented silicon steel resistant to stress-relief annealing and manufacturing method therefor
US11355275B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2018 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Dec 5, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F3/06
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A laser-scribed grain-oriented silicon steel resistant to stress-relief annealing and a manufacturing method therefor. Parallel linear grooves (20) are formed on one or both sides of grain-oriented silicon steel (10) by laser etching. The linear grooves (20) are perpendicular to, or at an angle to, the rolling direction of the steel plate. A maximum height of edge protrusions of the linear grooves (20) does not exceed 5 μm, and a maximum height of spatters in etch-free regions between adjacent linear grooves (20) does not exceed 5 μm, and the proportion of an area occupied by spatters in the vicinity of the linear grooves (20) does not exceed 5%. The steel has low manufacturing costs, and the etching effect of the finished steel is retained during a stress-relief annealing process. The steel is suitable for manufacturing of wound iron core transformers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.