Underfill method for semiconductor package
US11355360B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Sep 30, 2019 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Sep 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are an underfill method and apparatus for a semiconductor package, the underfill method includes loading a substrate; charging a filler to be filled in between the substrate and a device; applying the filler to the substrate; and subjecting the applied filler to an electric field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.