Transfer apparatus of an electronic component
US11355365B2 · kind B2 · utility
0Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2018 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Jan 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0753
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.