Adhesive film, semiconductor apparatus using the same, and semiconductor package including the same
US11355413B2 · kind B2 · utility
1Cited by
4References
22Claims
0Family size
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Key dates
| Filing date | Aug 14, 2019 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Sep 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.