Image sensor panel and method for fabricating the same
US11355538B2 · kind B2 · utility
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1References
15Claims
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Key dates
| Filing date | Aug 15, 2018 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Oct 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an image sensor panel (ISP) and a method for fabricating the image sensor panel (ISP). In one aspect, the method includes forming a well in an assembly, forming a bottom electrode in the well, forming a photosensitive layer in the well, and forming a top electrode over the photosensitive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.