Packaging unit, component packaging structure and preparation method thereof
US11355543B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 28, 2018 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Aug 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging unit, a component packaging structure and a preparation method thereof. The packaging unit includes a bonding substrate and spacers formed on the bonding substrate through a patterning process, wherein the bonding substrate is reserved with packaging regions for applying sealant. When the packaging unit is used to package a component, because the spacer(s) is supported between the bonding substrate and the base substrate, the packaging unit is easy to separate from the base substrate At the same time, the packaging unit has little or no damage to the base substrate and elements formed on the base substrate, thus effectively protecting the performance of the base substrate and the elements on the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.