Compact vertical cavity surface emitting laser package
US11355901B1 · kind B1 · utility
3Cited by
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22Claims
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Key dates
| Filing date | Dec 23, 2019 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Jan 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A vertical cavity surface emitting laser (VCSEL) die package includes a bottom substrate comprising a bottom contact pad electrically contacting a bottom electrode on a bottom surface of a VCSEL die. The VCSEL die package includes a submount including a submount contact pad electrically contacting a first electrode on another surface of the VCSEL die. The submount contact pad overlaps a portion of the first electrode, wherein the VCSEL die is positioned between the submount and the bottom substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.