Flexible cover board, manufacturing method thereof, and display device
US11357124B2 · kind B2 · utility
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20Claims
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Assignee
Inventor
Key dates
| Filing date | Jan 13, 2020 |
| Grant date | Jun 7, 2022 |
| Priority date | — |
| Expiry date | Nov 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/331
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A flexible cover board, a manufacturing method thereof, and a display device are provided. The flexible cover board includes a flexible substrate, a buffer layer, a first hardened layer, an organic layer, and a second hardened layer. The buffer layer is disposed on a side surface of the flexible substrate, and at least one through-hole penetrating the buffer layer is filled with a nanomaterial. The first hardened layer, the organic layer, and the second hardened layer stacked in sequence are disposed on a side surface of the buffer layer away from the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.