Cutting tools having microstructured and nanostructured refractory surfaces
US11358241B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2015 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Mar 16, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one aspect, cutting tools are provided comprising radiation ablation regions defining at least one of refractory surface microstructures and/or nanostructures. For example, a cutting tool described herein comprises at least one cutting edge formed by intersection of a flank face and a rake face, the flank face formed of a refractory material comprising radiation ablation regions defining at least one of surface microstructures and surface nanostructures, wherein surface pore structure of the refractory material is not occluded by the surface microstructures and surface nanostructures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.