Microwave-resistant mouldings
US11359051B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2018 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Mar 14, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan δ of not more than 8.30×10−3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.