Polyimide films and electronic devices
US11359061B2 · kind B2 · utility
1Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2020 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Nov 15, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In a first aspect, a polyimide film includes a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. The polyimide film has a b* of less than one for a film thickness of at least 30 microns and a glass transition temperature of less than 300° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.