Patent · US Active

Silicone composite for high temperature applications

US11359094B2 · kind B2 · utility

0Cited by

2References

11Claims

0Family size

Assignees

Inventors

Dejie Tao · Fremont, US
Lei Wang · Shanghai, CN
Yiliang Wu · Oakville, CA
Ting Gao · Sunnyvale, US
Andre Martin Dressel · Lampertheim, DE
Marco Wolf · Wesel, DE
Mei Dong · Taiyuan, CN

Key dates

Filing date	Jan 8, 2020
Grant date	Jun 14, 2022
Priority date	—
Expiry date	May 22, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01M50/24
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.