Polymer-metal junction
US11359120B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Sep 13, 2018 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Sep 13, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2371/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a polymer-metal junction including a polymer composition in contact with a metal substrate, where the polymer composition comprises a polymer component including a PEEK-PEDEK copolymer having a PEEK/PEDEK mole ratio ranging from about 60/40 to about 30/70 and a melting point (Tm) greater than 320° C., and where the polymer composition includes less than 10 wt. % of a sulfur-or-carbonyl-containing solvent, based on the total weight of the polymer composition. Also disclosed are methods of making the polymer-metal junction and articles including the polymer-metal junction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.