Patent · US Active

Self-supporting ultra-fine nanocrystalline diamond thick film

US11359276B2 · kind B2 · utility

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2References

10Claims

0Family size

Assignee

NINGBO INSTITUTE OF MATERIALS TECHNOLOGY & ENGINEERING, CHINESE ACADEMY OF SCIENCES · CN

Inventors

Nan Jiang · Tangxia, CN
He Li · Zhejiang, CN
Bo Wang · Tuji, CN
Jian Yi · Shanghai, CN
Yang Cao · Niskayuna, US

Key dates

Filing date	Apr 18, 2018
Grant date	Jun 14, 2022
Priority date	—
Expiry date	Apr 18, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C16/50
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A self-supporting ultra-fine nanocrystalline diamond thick film, the thickness being 100-3000 microns, wherein 1 nanometer≤diamond grain size≤20 nanometers. A method for using chemical vapor deposition to grow ultra-fine nanocrystalline diamond on a silicon substrate, and separating the silicon substrate and the diamond to acquire the self-supporting ultra-fine nanocrystalline diamond thick film. The chemical vapor deposition method is simple and effective, and prepares a high-quality ultra-fine nanocrystalline diamond thick film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.