Identifying and mitigating tight spots in a borehole using bottom hole assembly components as test probes
US11359477B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 20, 2019 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Jun 24, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45129
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A computer-implemented method includes monitoring, by a computing device, data measurements associated with a bottom hole assembly (BHA), and detecting, by the computing device, a plurality of possible tight instances. An individual possible tight spot instance is detected based on a data measurement satisfying a threshold. The method also includes determining, by the computing device, information identifying respective probe depths of a plurality of probes incorporated by the BHA for the individual possible tight spot instance, storing, by the computing device and in a table, the information identifying the respective probe depths for each possible tight spot instance, generating, by the computing device, a profile identifying tight spot depths based on information stored in the table; and executing, by the computing device, a mitigating instruction based on the profile to mitigate the presence of the identified tight spot depths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.