Patent · US Active

Package of laminations, manufacturing method, multi-plate coupling and industrial application

US11359673B2 · kind B2 · utility

0Cited by

6References

11Claims

0Family size

Assignee

Flender GmbH · DE

Inventors

Andre Jansen · Roermond, NL
Stefan Kleinewegen · Bocholt, DE
Marcel Reidl · Vreden, DE
Gunter Scheithauer · Vreden, DE

Key dates

Filing date	Apr 2, 2020
Grant date	Jun 14, 2022
Priority date	—
Expiry date	Jul 19, 2040

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49789
WIPO fieldMechanical elements
WIPO sectorMechanical engineering

Abstract

A package of laminations includes a plurality of lamella segments, which are arranged in layers and embodied to be connected together as ring segments. Each of the lamella segments has a plurality of cutouts and at least one of the lamella segments has at least three cutouts. The lamella segments are interconnected via sleeves. A method for manufacturing a package of laminations, a multi-plate coupling employing the package of laminations and an industrial application using the package of laminations are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.