Thickness-shear mode resonators
US11359983B1 · kind B1 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2020 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Sep 18, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0426
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A quartz pressure sensor that resonates in the thickness-shear mode can include a center resonator structure and first and second caps joined to the center resonator structure by bond joints. Each bond joint is comprised of a sealing glass having thickness less than 0.0012 inches (˜30 μm) and a melting point less than 573° C. The quartz pressure sensor can additionally include an inner diameter edge feature formed between the interior sidewall in the joint sidewall of the caps that reduces stresses at the bond joints and/or a high stress point in the cap bore.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.