Patent · US Active

LIDAR chip having multiple component assemblies

US11360213B2 · kind B2 · utility

1Cited by

2References

20Claims

0Family size

Assignee

SiLC Technologies, Inc. · US

Inventors

Mehdi Asghari · Pasadena, US
Dazeng Feng · Arcadia, US
Bradley Jonathan Luff · San Marino, US

Key dates

Filing date	Jan 25, 2019
Grant date	Jun 14, 2022
Priority date	—
Expiry date	Apr 16, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG02B2006/1215
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The chip includes multiple component assemblies that are each configured to generate and steer a direction of a LIDAR output signal that exits from the chip. The LIDAR output signals generated by different components assemblies have different wavelengths.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.