Optoelectronic ball grid array package with fiber
US11360278B2 · kind B2 · utility
13Cited by
70References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 29, 2015 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Apr 10, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.