Electronic device fabric integration
US11360512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2019 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Feb 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.