Heat dissipation structure for chip-on-film, manufacturing method thereof, and display device
US11362015B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 22, 2018 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Apr 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/4985
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure and a manufacturing method thereof and a display device. The heat dissipation structure includes: a heat dissipation plate body, including an evaporation part and a condensation part; a plurality of micro-cavity structures, disposed in the heat dissipation plate body, two ports of each of the micro-cavity structures being sealed, and the micro-cavity structures being filled with liquid. Each of the micro-cavity structures extends from the evaporation part to the condensation part, and after the liquid absorbs heat at the evaporation part to change into vapor, the vapor moves toward the condensation part, and the vapor moved to the condensation part is condensed and liquefied and moves toward the evaporation part to achieve heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.