Transaxle with semiconductor device cooling arrangement
US11362016B2 · kind B2 · utility
0Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2018 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Mar 26, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S903/91
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This disclosure relates to a motor vehicle including a transaxle with a cooling arrangement for semiconductor devices such as IGBTs or MOSFETs, and a corresponding method. In particular, this disclosure relates to a motor vehicle, such as an electrified vehicle, including a transaxle, a plurality of semiconductor devices mounted adjacent the transaxle, and a source of cooling fluid. The semiconductor devices are exposed to fluid from the source that flows into the transaxle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.