Semiconductor device comprising sealing members with different elastic modulus and method for manufacturing semiconductor device
US11362019B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 14, 2020 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Apr 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an aspect of the present disclosure, a semiconductor device includes a base plate, a first semiconductor chip provided above the base plate, a bonding wire joined with the first semiconductor chip at a first joint part and having a curved part above the first joint part, a first sealing member provided from an upper surface of the base plate up to a height higher than the first joint part and lower than the curved part, the first sealing member covering the first joint part and a second sealing member provided on the first sealing member, covering the curved part, and having an elastic modulus lower than an elastic modulus of the first sealing member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.