Bonding and indexing apparatus
US11362058B2 · kind B2 · utility
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2References
20Claims
0Family size
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Key dates
| Filing date | Dec 27, 2018 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Apr 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/86203
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding and indexing apparatus has a first index head to move a substrate in an indexing direction from a first position to a second position and a second index head to move the substrate in an indexing direction from the second position to a third position. The first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.