Transducer system with configurable acoustic overload point
US11363387B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2021 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Feb 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.