Printed circuit board including electroconductive pattern and electronic device including printed circuit board
US11363711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2018 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Oct 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.