Complex laser folding and fabrication
US11364566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2018 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Apr 9, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.